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T17e maintenance guide i requirements for maintenance platform 1

T e Maintenance Guide T e Maintenance Guide Edition Date - - File category Maintenance program Content of this volume mainly describe how to troubleshoot various faults of the T e hashboard and how to use test ?xtures for accurate positioning ?? The copyright of this article belongs to Bitmaintech Pte Ltd Bitmain The article shall solely be reprinted extracted or used in any other ways with the permission of the copyright owner Please contact Bitmain o ?cial customer service if there is any need of reprinting or quoting I Requirements for Maintenance Platform Platform requirements Rubber mat maintenance platform the platform needs to be grounded antistatic wristband and ground connection Equipment requirements Constant temperature soldering iron ?? ? the head of tip soldering iron is used to solder small patches such as chip resistors and capacitors etc heat gun BGA rework station for chip BGA disassembly and soldering multimeter soldering steel pin and shrink tubing for easy measurement Fluke recommended oscilloscope Agilent recommended Testing tool requirements APW power supply APW V- VV uF V and power patch cord selfmade for power supply of hashboard control board test ?xture Requirements for maintenance auxiliary materials tool Low-temperature solder paste Alpha OM ux water for cleaning panel and anhydrous alcohol water for cleaning panel is used to clean up soldering residues after repair thermal conductive paste is used to apply on chips heat sinks after maintenance some models require thermal conductive paste tin-planting steel mesh ball-planting steel mesh solder wire solder ball ball diameter is recommended to be mm when replacing a new chip you need to plant tin on chip pin and the BSM surface before soldering them to the hashboard Demand for common maintenance spare materials resistance R R K K resistance R capacitor uf uf II Maintenance Requirements Maintenance personnel must have certain electronic knowledge more than one year of maintenance experience and be pro ?cient in BGA QFN LGA package soldering technology After repairing the hashboard must be tested to be OK for more than twice otherwise it shall be rejected CT e Maintenance Guide Please pay attention to the operation method when replacing the chip There should be no obvious deformation of the PCB board after replacing any accessories Check whether there are any open or short circuits or missing parts in the replacement parts and the surroundings Check the tools con ?rm whether the test ?xtures can work normally determine the test software parameters for the maintenance station and version of test ?xtures etc After passing the repair and replacement chip test you need to check the full chip before performing the functional test The functional test shall ensure that the double-sided heat sinks are soldered OK and the cooling fan is at full speed When using the chassis cooling function you must put hashboards at the same time to form air duct The single-sided test of production must also ensure the formation of air ducts important When measuring the signal two fans are used to