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Csn33 bga user guide CSN Micron BGA Manufacturer ? s User Guide Introduction Customer Service Note BGA Manufacturer ? s User Guide for Micron BGA Parts Introduction This customer service note provides information that will enable customers to easily integ

CSN Micron BGA Manufacturer ? s User Guide Introduction Customer Service Note BGA Manufacturer ? s User Guide for Micron BGA Parts Introduction This customer service note provides information that will enable customers to easily integrate both leading-edge and legacy Micron ball grid array BGA packages into their manufacturing processes It is intended as a set of high-level guidelines and a reference manual describing typical package- related and manufacturing process- ow practices The recommendations and suggestions provided in this customer service note serve as a guideline to help the end user to develop user-speci ?c solutions It is the responsibility of the end user to optimize the process to obtain the desired results Because the package landscape changes rapidly and information can become outdated very quickly refer to the latest product speci ?cations Contact your sales representative for any additional questions not covered within this guide An overview of a typical BGA package and its components are shown in Figure Figure Ball Grid Array Package Dual Die Wire Bonded Silicon die Wire bond typically gold Die attach layer or ip chip with solder bumps Solder ball Mold compound PCB substrate JEDEC Terminology This document uses JEDEC terminology JEDEC-based BGA devices in the semiconductor industry are identi ?ed by two key attributes ? Maximum package height pro ?le ? Ball pitch For example TFBGA mm package height and less than mm ball pitch Package descriptors F through F have been added to provide more detailed ball pitch information for devices with a ball pitch of less than mm Within the industry many memory manufacturers continue to use only the ??F ? descriptor for any ball pitch of mm or less see JEDEC JESD E for additional information Maximum package height pro ?le and ball pitch codes based on the JEDEC standard are shown in Tables PDF aef f Source aef f e csn bgauser guide fm - Rev C EN Micron Technology Inc reserves the right to change products or speci ?cations without notice ? Micron Technology Inc All rights reserved Products and speci ?cations discussed herein are for evaluation and reference purposes only and are subject to change by Micron without notice Products are only warranted by Micron to meet Micron ? s production data sheet speci ?cations All information discussed herein is provided on an ??as is ? basis without warranties of any kind CCSN Micron BGA Manufacturer ? s User Guide BGA Coplanarity and Warpage Measurement Guidelines Table and Ball Pitch Dimensions and Code JESD E Code E Blank F Name Enlarged Standard Fine F Fine F Fine F Fine F Fine F Fine F Fine Dimension ? mm ? mm and ?? mm mm mm mm mm mm mm mm Table BGA Maximum Package Height Pro ?le JESD E Code ?? ?? B Blank L T V W U X ?? ?? ?? ?? Subcode B B ?? ?? ?? ?? ?? ?? ?? ?? X X X X Pro ?le Description Extra thick Very thick Thick